• Power：＞15W@800kHz

• Max Energy：＞18.8μJ@800kHz

• Narrow laser head width (27cm)

• Stable output power; Output window replaceable on-site

• excellent beam quality; consistent beam parameters

• Applicable even in some harsh circumstances;

• Reliability for 7*24 operation

Applications：

• Laser cutting and drilling of brittle materials such as

• OLED, semiconductor materials, printed circuit

• Flexible Printed Circuit (FPC) dicing and drilling

• Printed Circuit board and wafer precision marking

• PI, PET, PMMA, PET etc cutting

• QR code engraving on glass and sapphire

• Li-ion battery electrodes cutting